MediaTek has launched new mainstream chipsets for Wi-Fi 7, the Filogic 860 and 360, growing its portfolio beyond the flagship Filogic 880 and Filogic 380 chipsets launched earlier in 2023.
Powering next-gen access points, the Filogic 860 borrows many of the same innovations as the 880, such as single MAC MLO, and MediaTek Xtra Range® technology, ensuring it performs ahead of competitors, while opting for a triple core Arm Cortex-A73 CPU and multi-gigabit Wi-Fi 7 speeds and seamless tri-band connectivity that offer a compelling upgrade over Wi-Fi 6E.The Filogic 860 platform includes with the following features:
- Industry leading 6nm low-power Wi-Fi design
- Single-MAC MLO support
- Supports 4096-QAM and MRU
- Supports dual-band Wi-Fi 7 with industry-highest dual-band MLO speed, 7.2Gbps
- Dual-band, dual concurrent capabilities with 4T4R for 2.4GHz up to BW40 and 5T5R 4SS for 5GHz up to 160MHz bandwidth
- Support for an additional receive antenna for zero-wait DFS
- Filogic Xtra range support, boosting receiving distance using an extra antenna
The new Filogic 360 is a stand-alone, single chip that combines Wi-Fi 7 and dual Bluetooth 5.4. The chip will empower clients such as smartphones, PCs, laptops, set-top boxes, OTT streaming, and many other devices with best-in-class connectivity in their segment.
Key features of the Filogic 360 include:
- Tri-band selectable Wi-Fi 7 2x2 with up to 2.9Gbps speed
- Supports 4096-QAM and MRU
- 160MHz channel bandwidth support
- Filogic Xtra range support, boosting communication distance by unique Hybrid MLO solution
- Dual Bluetooth 5.4 cores that support simultaneous peripherals for gaming and other applications
- BLE audio with integrated DSP for LC3 codec support
- MediaTek advanced Wi-Fi and Bluetooth coexistence technology ensures both technologies can operate on the 2.4 GHz band seamlessly, without interference
